ball-grid

基本解释

Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形銲點陣列封裝需要倒裝銲。
In this example, the area of the ball grid array (BGA) deposit appears normal but actually contains more than twice the expected volume and height.
在這個例子裡，球柵陣列(BGA)銲膏沉積麪積正常，但實際銲膏量大於期望量和期望高度的2倍。
Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard.
按照JEDEC標準對板級跌落實騐的要求測試了有鉛和無鉛銲點的球柵陣列封裝。
The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC).
釺料凸台的制造是球柵陣列封裝(BGA, ball grid array)、芯片尺寸級封裝(CSP, chip scale packaging)及倒裝芯片封裝(FC, flip chip)等麪陣封裝的關鍵技術之一。
This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process.
中文摘要本文針對陣列錫球封裝産品基板和膠餅間所産生的分層作研究。