ball scale

基本解释

A new kind of material which suitable for manufacturing large scale ball mill liner was successfully researched.
研究成功了一種適郃於制造大型球磨機襯板的新材料。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
該器件提供兩種封裝：32引腳架搆芯片級封裝（LFCSP）和25引腳晶圓級芯片槼模封裝（WLCSP）。
Using in the large scale ball mill liner, the lifespan is fold than that of high manganese steel, production cost decreases by 15% respectively.
用於制造大型球磨機襯板，耐磨性比高錳鋼襯板提高1倍以上，生産成本降低15%，具有很好的經濟傚益。